PRODUCT
High thermal conductivity gel
Typical use: LED chip, communication equipment, mobile phone CPU, memory module, IGBT and other power modules, power semiconductor interstitial heat conduction
Key words:
Silicone Series, Epoxy Series, Ultraviolet Curing (UV) Series
Classification:
Product Description
| Category | Product Model | Thermal conductivity (W/m.K) | Density (g/cm3) | Features | Typical use |
| single component thermal conductive gel | TLN-30 | 3.6 | 3.01 | Good extrusion | LED chip, communication equipment, mobile phone CPU, memory module, IGBT and other power modules, power semiconductor interstitial heat conduction. |
| TLG-608 | 2.5 | 2.88 | Good extrusion | ||
| two-component thermally conductive gel | GA-2335-2 | 3.5 | 3.05 | good liquidity |
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