PRODUCT
Features: epoxy potting: two-component modified epoxy potting glue is cured at room temperature or temperature, and the cured product has the characteristics of smooth surface, good toughness and good insulation. The product has low viscosity before curing, good operation performance, moderate operation and curing time at room temperature, simple glue dispensing and convenient use. Use temperature range -25 ℃ 130 ℃, is a new generation of epoxy resin potting adhesive.