PRODUCT
Epoxy potting compound
Features: epoxy potting: two-component modified epoxy potting glue is cured at room temperature or temperature, and the cured product has the characteristics of smooth surface, good toughness and good insulation. The product has low viscosity before curing, good operation performance, moderate operation and curing time at room temperature, simple glue dispensing and convenient use. Use temperature range -25 ℃ 130 ℃, is a new generation of epoxy resin potting adhesive.
Key words:
Silicone Series, Epoxy Series, Ultraviolet Curing (UV) Series
Classification:
Product Description
Features:
Epoxy potting: two-component modified epoxy potting glue is cured at room temperature or temperature, and the cured product has the characteristics of smooth surface, good toughness and good insulation. The product has low viscosity before curing, good operation performance, moderate operation and curing time at room temperature, simple glue dispensing and convenient use. Use temperature range -25 ℃ 130 ℃, is a new generation of epoxy resin potting adhesive.
Maintaining the low cost of traditional epoxy resin potting glue, changing the traditional epoxy potting glue internal stress, colloid hard and brittle defects, and thus widely used in electronic components potting, is a cost-effective insulation potting material.
Application:
Epoxy potting glue: mainly used for potting protection of various electronic components, such as various specifications of electronic transformers, negative ion generators, module power supply, capacitors, transformers and other types of electronic components of insulation potting, moisture-proof sealing, etc., to achieve long-term reliable protection of sensitive circuits and components.
main models:GEPX-04,GEPX-04W,GEPX-08B,GEPX-08W,GEPX-09……
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