PRODUCT
High thermal conductivity potting adhesive
Typical use: new energy vehicle DC/AC power supply, OBC system, VCF module, rail transit motor, communication base station high power module high thermal conductivity potting
Key words:
Silicone Series, Epoxy Series, Ultraviolet Curing (UV) Series
Classification:
Product Description
| Category | Product Model | Thermal conductivity (W/m.K) | Density (g/cm3) | Features | Typical use |
| heat conductive potting adhesive | TLN-230-2 | 2 | 2.7 | Low viscosity, good fluidity | New energy vehicle DC/AC power supply, OBC system, VCF module, rail transit motor, communication base station high-power module high thermal conductivity potting |
| TLG-508 | 2.5 | 2.9 | Low viscosity, adhesion to aluminum substrate, shear strength 0.5(MPa) | ||
| TLG-509 | 3.3 | 3.1 | good liquidity |
Previous： High thermal conductivity gel
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