PRODUCT
Solvent-free three-proof paint
Recommend model: GC-602. Features: meet the requirements of environmental protection policy, the composition of one hundred percent solid, the reaction has uniformity, the dimensional stability of the film is good, the viscosity is moderate (can be sprayed, brush, dip)
Typical use: LED chip, communication equipment, mobile phone CPU, memory module, IGBT and other power modules, power semiconductor interstitial heat conduction
High thermal conductivity potting adhesive
Typical use: new energy vehicle DC/AC power supply, OBC system, VCF module, rail transit motor, communication base station high power module high thermal conductivity potting
Typical applications: PTC device heat conduction structure bonding/communication chip high heat conduction structure bonding/general component heat conduction structure bonding/high power component heat conduction structure bonding LED chip, communication base station module, new energy vehicle electric control module, etc./room temperature curing structure bonding
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SAF Coolest v1.3.1.2 设置面板 GDISD-ZVYB-READE-ZFZ
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