PRODUCT
Thermally conductive adhesive
Typical applications: PTC device heat conduction structure bonding/communication chip high heat conduction structure bonding/general component heat conduction structure bonding/high power component heat conduction structure bonding LED chip, communication base station module, new energy vehicle electric control module, etc./room temperature curing structure bonding
Key words:
Silicone Series, Epoxy Series, Ultraviolet Curing (UV) Series
Classification:
Product Description
| Category | Product Model | Thermal conductivity (W/m.K) | Density (g/cm3) | Features | Typical use |
| One-component thermal conductive adhesive | NS-0856G(LH01) | 1.2 | 2.5 | Addition molding, shear strength 3.5(Mpa) | PTC device heat conduction structure bonding |
| NS-085Z | 2 | 2.72 | addition type | Communication chip high thermal conductivity structure bonding | |
| TLD-715 | 0.8 | 2.35 | Condensation type, shear strength 2.5(Mpa), yellowing resistance | General-purpose components Thermal conductive structure bonding | |
| GO-1701-1 | 1.8 | 2.65 | Condensation type, shear strength 1.7(Mpa) | High power components heat conduction structure bonding | |
| Two-component thermally conductive adhesive | NS-0824G(SH01) | 2 | 2.77 | Addition type, room temperature curing, shear strength 0.5(Mpa), | LED chips, communication base station modules, new energy vehicle electronic control modules, etc, |
| Room Temperature Curing Structural Bonding |
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