PRODUCT
Typical use: LED chip, communication equipment, mobile phone CPU, memory module, IGBT and other power modules, power semiconductor interstitial heat conduction
High thermal conductivity potting adhesive
Typical use: new energy vehicle DC/AC power supply, OBC system, VCF module, rail transit motor, communication base station high power module high thermal conductivity potting
Typical applications: PTC device heat conduction structure bonding/communication chip high heat conduction structure bonding/general component heat conduction structure bonding/high power component heat conduction structure bonding LED chip, communication base station module, new energy vehicle electric control module, etc./room temperature curing structure bonding
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SAF Coolest v1.3.1.2 设置面板 GDISD-ZVYB-READE-ZFZ
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