High thermal conductivity gel


Typical use: LED chip, communication equipment, mobile phone CPU, memory module, IGBT and other power modules, power semiconductor interstitial heat conduction

High thermal conductivity potting adhesive


Typical use: new energy vehicle DC/AC power supply, OBC system, VCF module, rail transit motor, communication base station high power module high thermal conductivity potting

Thermally conductive adhesive


Typical applications: PTC device heat conduction structure bonding/communication chip high heat conduction structure bonding/general component heat conduction structure bonding/high power component heat conduction structure bonding LED chip, communication base station module, new energy vehicle electric control module, etc./room temperature curing structure bonding

One-component condensation (addition) glue


Tori adhesive silicone rubber includes one-component addition glue and one-component condensation glue. One-component condensation glue, when used, by contact with the moisture in the air to vulcanize into elastic solid. It can be used for a long time in the temperature range of -60~200 ℃, has excellent electrical insulation performance and chemical stability, and can resist water, ozone and weathering. Good adhesion to a variety of metal and non-metallic materials. One-component addition glue, can heat up fast curing, easy to use, after curing with good adhesion, high strength, excellent aging resistance. It has the characteristics of moisture-proof, waterproof, ozone resistance, radiation resistance, weather aging resistance, etc., can withstand high temperature 280°C, good electrical performance, good chemical stability, and non-corrosive. Application: One-component condensation glue: suitable for elastic bonding, fixing, insulation and sealing of various electronic components and electrical equipment. One-component addition glue: suitable for the inner layer of PTC ceramic bonding, can also be used for high temperature-resistant use of electronic, electrical appliances, instrumentation components bonding, moisture-proof, shockproof, insulation, sealing effect. Main models: 8516G,GO-1132-1,TLD-132,TLD-985,GO-1700-1,TLD-712S,TLD-714B,GO-1135W-1,TLD-704S,TLD-704,NS-085......

One-component UV curing adhesive


A one-component UV curing adhesive designed for the modern electronics industry. Contains UV photosensitizer, when used by UV irradiation, can be quickly cured. After curing, the product does not bubble, no fog, good weather resistance. It is non-corrosive to metal and non-metal materials and can be cured at the same time inside and outside. Application: Mainly used in mobile phone screen, glass and other bonding and electronic circuit board protection; can also be applied to weather resistance, acid and alkali resistance and other requirements of sealing protection. For example, the bonding and sealing between the glass and the glass of the liquid crystal display screen of various specifications can play a sealing protection in the glass corrosion thinning, so as to achieve the purpose of protecting the bonding surface from corrosion. Main models: TLUV-1,TG-352,H-7,UV-270A,UV-106B......

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